Semiconductor Automatic Optical Inspection (AOI)
Semiconductor Wafer Process Detection Reagents Fully Automatic Wafer Storage Management System High-Precision Die Cutting and Forming System Turret-Type Test Handler Semiconductor Automatic Optical Inspection (AOI) Laser Grooving and Dicing Machine Sales of DMG MORI Precision Machine Tools
Semiconductor Automatic Optical Inspection (AOI)
Semiconductor Automatic Optical Inspection (AOI)

1Visual Inspection Function:

o Bottom Vision:

l 2D: Ball width/spacing/offset/quality/contrast/compression/missing/body size X/body size Y/offset X/offset Y/parallelism/orthogonality;

l 3D: Ball height/coplanarity/warpage, with WX, WY display;

l Surface: Scratches, exposed copper, pits, dirt, etc.

o Top Vision:

l Dimensional items: Mark position/mark angle/mark margin/character offset (can reflect the margin of each character mark);

l Print inspection items: Contrast/bottom print/top print/spot size;

l Surface: Scratches, voids, pits, dirt, etc.

o Side Vision:

l Surface: Voids, chipped edges, burrs, etc.

2Thickness Measurement Function:

o SBT+MOLD thickness;

o Total height.

3Capable of detecting stacked, tilted, or missing materials on trays during outfeed inspection with no false alarms and the ability to overcome certain Tray warpage.

4Test misjudgment rate ≤ 0.3%.

5Provides 100% detection for appearance golden samples (e.g., scratches, pits, discoloration, etc.).

6The suction nozzle has an Auto Pitch function, automatically adjusting the suction nozzle pitch based on the Tray parameters of the Recipe.




400-163-0168