（1）Clean storage of wafer FOUPs;
（2）Intelligent scheduling with a throughput of 400+ wafers/hour;
（3）Rapid transfer by robotic arms.
（1）Storage capacity up to 3200/6400 wafers, providing powerful storage;
（2）Smallest footprint compared to other manufacturers, occupying only 70% of space;
（3）High-speed transmission ensures fast and reliable wafer handling;
（4）Optional N2 and XCDA introduction for low-oxygen/low-humidity storage environment.
